BDN09-3CB

CTS Thermal Management Products

Product No:

BDN09-3CB

Package:

-

Batch:

-

Datasheet:

-

Description:

HEATSINK CPU .91" SQ

Quantity:

Delivery:

Payment:

In Stock : 990

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    1.311

    1.311

  • 10

    1.2483

    12.483

  • 25

    1.21562

    30.3905

  • 50

    1.18275

    59.1375

  • 100

    1.11701

    111.701

  • 250

    1.051308

    262.827

  • 500

    0.985606

    492.803

  • 1000

    0.919904

    919.904

  • 5000

    0.887053

    4435.265

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Product Information

Parameter Info
User Guide
Mfr CTS Thermal Management Products
Type Top Mount
Shape Square, Pin Fins
Width 0.910" (23.11mm)
Length 0.910" (23.11mm)
Series BDN
Package Box
Diameter -
Material Aluminum
Fin Height 0.355" (9.02mm)
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Product Status Active
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Not Included)
Base Product Number BDN09
Thermal Resistance @ Natural 26.90°C/W
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 9.60°C/W @ 400 LFM