Samtec Inc.
Product No:
ESQT-106-03-MM-Q-309
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
CONN SOCKET 24POS 0.079 GOLD PCB
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Mfr | Samtec Inc. |
Style | Board to Board or Cable |
Series | ESQT |
Package | Bulk |
Features | - |
Termination | Solder |
Applications | - |
Contact Type | Forked |
Contact Shape | Square |
Mounting Type | Through Hole |
Connector Type | Elevated Socket |
Fastening Type | Push-Pull |
Number of Rows | 4 |
Pitch - Mating | 0.079" (2.00mm) |
Product Status | Active |
Voltage Rating | - |
Contact Material | Phosphor Bronze |
Insulation Color | Black |
Insulation Height | 0.309" (7.85mm) |
Ingress Protection | - |
Base Product Number | ESQT-106 |
Insulation Material | Liquid Crystal Polymer (LCP) |
Number of Positions | 24 |
Row Spacing - Mating | 0.079" (2.00mm) |
Contact Finish - Post | Tin |
Contact Length - Post | 0.149" (3.78mm) |
Current Rating (Amps) | 4.5A per Contact |
Operating Temperature | -55°C ~ 125°C |
Mated Stacking Heights | - |
Contact Finish - Mating | Gold |
Number of Positions Loaded | All |
Material Flammability Rating | UL94 V-0 |
Contact Finish Thickness - Post | - |
Contact Finish Thickness - Mating | 20.0µin (0.51µm) |