ESQT-108-02-M-D-465
Samtec Inc.
Product No:
ESQT-108-02-M-D-465
Manufacturer:
Package:
-
Batch:
-
Datasheet:
-
Description:
CONN SOCKET 16POS 0.079 GOLD PCB
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In Stock : Please Inquiry 
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Product Information
Parameter Info
User Guide
| Mfr | Samtec Inc. |
| Style | Board to Board or Cable |
| Series | ESQT |
| Package | Bulk |
| Features | - |
| Termination | Solder |
| Applications | - |
| Contact Type | Forked |
| Contact Shape | Square |
| Mounting Type | Through Hole |
| Connector Type | Elevated Socket |
| Fastening Type | Push-Pull |
| Number of Rows | 2 |
| Pitch - Mating | 0.079" (2.00mm) |
| Product Status | Active |
| Voltage Rating | - |
| Contact Material | Phosphor Bronze |
| Insulation Color | Black |
| Insulation Height | 0.465" (11.80mm) |
| Ingress Protection | - |
| Base Product Number | ESQT-108 |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Number of Positions | 16 |
| Row Spacing - Mating | 0.079" (2.00mm) |
| Contact Finish - Post | Tin |
| Contact Length - Post | 0.385" (9.78mm) |
| Current Rating (Amps) | 4.5A per Contact |
| Operating Temperature | -55°C ~ 125°C |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | - |
| Contact Finish Thickness - Mating | 20.0µin (0.51µm) |
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