Omron Electronics Inc-EMC Div
Product No:
XG8W-2631
Manufacturer:
Package:
-
Batch:
-
Description:
CONN HEADER VERT 26POS 2.54MM
Quantity:
Delivery:
Payment:
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
1.7575
1.7575
10
1.5314
15.314
100
1.36876
136.876
500
1.140646
570.323
1000
0.977692
977.692
5000
0.94505
4725.25
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Mfr | Omron Electronics Inc-EMC Div |
Style | Board to Board or Cable |
Series | XG8 |
Package | Bulk |
Features | - |
Shrouding | Unshrouded |
Termination | Solder |
Applications | - |
Contact Type | Male Pin |
Contact Shape | Square |
Mounting Type | Through Hole |
Connector Type | Header |
Fastening Type | Push-Pull |
Number of Rows | 2 |
Pitch - Mating | 0.100" (2.54mm) |
Product Status | Active |
Voltage Rating | 300V |
Contact Material | Brass, Nickel |
Insulation Color | Black |
Insulation Height | 0.098" (2.50mm) |
Ingress Protection | - |
Base Product Number | XG8W |
Insulation Material | Polybutylene Terephthalate (PBT), Glass Filled |
Number of Positions | 26 |
Row Spacing - Mating | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Length - Post | 0.118" (3.00mm) |
Current Rating (Amps) | 3A |
Operating Temperature | -55°C ~ 105°C |
Mated Stacking Heights | - |
Overall Contact Length | 0.453" (11.50mm) |
Contact Finish - Mating | Gold |
Contact Length - Mating | 0.236" (6.00mm) |
Number of Positions Loaded | All |
Material Flammability Rating | UL94 V-0 |
Contact Finish Thickness - Post | 5.90µin (0.150µm) |
Contact Finish Thickness - Mating | 5.90µin (0.150µm) |