HSB17-404025
CUI Devices
Product No:
HSB17-404025
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 40 X 40 X 25 MM
Quantity:
Delivery:
Payment:
In Stock : 804 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
2.4035
2.4035
10
2.3427
23.427
25
2.27962
56.9905
50
2.15308
107.654
100
2.026445
202.6445
250
1.89981
474.9525
500
1.836483
918.2415
1000
1.646502
1646.502
5000
1.614838
8074.19
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.575" (40.00mm) |
| Length | 1.575" (40.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.984" (25.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 6.41°C/W |
| Power Dissipation @ Temperature Rise | 11.7W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 2.10°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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