HSS08-B18-CP
CUI Devices
Product No:
HSS08-B18-CP
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, STAMPING, TO-218, 44.
Quantity:
Delivery:
Payment:
In Stock : 988 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
1.9475
1.9475
10
1.89905
18.9905
25
1.84794
46.1985
50
1.74534
87.267
100
1.642645
164.2645
250
1.539988
384.997
500
1.488669
744.3345
1000
1.334664
1334.664
5000
1.308996
6544.98
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Board Level, Vertical |
| Shape | Square |
| Width | 1.750" (44.45mm) |
| Length | 1.750" (44.45mm) |
| Series | HSS |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.492" (12.50mm) |
| Package Cooled | TO-218 |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | PC Pin |
| Thermal Resistance @ Natural | 7.29°C/W |
| Power Dissipation @ Temperature Rise | 10.3W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 3.50°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
