HSB18-232310
CUI Devices
Product No:
HSB18-232310
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 23 X 23 X 10 MM
Quantity:
Delivery:
Payment:
In Stock : 5332 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
0.988
0.988
10
0.9386
9.386
25
0.89148
22.287
50
0.86792
43.396
100
0.856235
85.6235
250
0.79762
199.405
500
0.750709
375.3545
1000
0.680333
680.333
5000
0.656878
3284.39
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.906" (23.00mm) |
| Length | 0.906" (23.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.394" (10.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 20.41°C/W |
| Power Dissipation @ Temperature Rise | 3.7W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 6.80°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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