HSB02-101007
CUI Devices
Product No:
HSB02-101007
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 10 X 10 X 7 MM
Quantity:
Delivery:
Payment:
In Stock : 3172 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
0.6365
0.6365
10
0.6061
6.061
25
0.57608
14.402
50
0.56088
28.044
100
0.553375
55.3375
250
0.515432
128.858
500
0.485127
242.5635
1000
0.439641
439.641
5000
0.424479
2122.395
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Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.394" (10.00mm) |
| Length | 0.394" (10.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.275" (7.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 37.90°C/W |
| Power Dissipation @ Temperature Rise | 2.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.50°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
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