HSB03-141406
CUI Devices
Product No:
HSB03-141406
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
HEAT SINK, BGA, 14 X 14 X 6 MM
Quantity:
Delivery:
Payment:
In Stock : 3465 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
0.703
0.703
10
0.67165
6.7165
25
0.63802
15.9505
50
0.6213
31.065
100
0.612845
61.2845
250
0.570912
142.728
500
0.53732
268.66
1000
0.486951
486.951
5000
0.470155
2350.775
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.551" (14.00mm) |
| Length | 0.551" (14.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.236" (6.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 35.98°C/W |
| Power Dissipation @ Temperature Rise | 2.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 15.80°C/W @ 200 LFM |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
Quick Links
