HSE-B20250-040H-01

CUI Devices

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HSE-B20250-040H-01

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Description:

HEAT SINK, EXTRUSION, TO-220, 25

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Parameter Info

User Guide

Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Angled Fins
Width	1.359" (34.50mm)
Length	0.984" (25.00mm)
Series	HSE
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.492" (12.50mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	PC Pin
Base Product Number	HSE-B20250
Thermal Resistance @ Natural	13.64°C/W
Power Dissipation @ Temperature Rise	5.5W @ 75°C
Thermal Resistance @ Forced Air Flow	4.44°C/W @ 200 LFM