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HSE-B250-04H

CUI Devices

Product No:

HSE-B250-04H

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-220, 25

Quantity:

Delivery:

Payment:

In Stock : 1133

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    1.1115

    1.1115

  • 10

    1.05735

    10.5735

  • 25

    1.02942

    25.7355

  • 50

    1.00168

    50.084

  • 100

    0.946105

    94.6105

  • 250

    0.890416

    222.604

  • 500

    0.834765

    417.3825

  • 1000

    0.779114

    779.114

  • 5000

    0.751288

    3756.44

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Board Level, Vertical
Shape Rectangular, Fins
Width 1.378" (35.00mm)
Length 0.984" (25.00mm)
Series HSE
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 1.000" (25.40mm)
Package Cooled TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Bolt On and PC Pin
Base Product Number HSE-B250
Thermal Resistance @ Natural 13.60°C/W
Power Dissipation @ Temperature Rise 8.0W @ 75°C
Thermal Resistance @ Forced Air Flow 3.26°C/W @ 200 LFM