CUI Devices
Product No:
HSE08-505028
Manufacturer:
Package:
-
Batch:
-
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Quantity:
Delivery:
Payment:
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
2.337
2.337
10
2.2572
22.572
25
2.19222
54.8055
50
2.06169
103.0845
100
1.852975
185.2975
250
1.826888
456.722
500
1.709449
854.7245
1000
1.683343
1683.343
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Mfr | CUI Devices |
Type | Board Level |
Shape | Rectangular, Angled Fins |
Width | 1.102" (28.00mm) |
Length | 1.969" (50.00mm) |
Series | HSE |
Package | Bag |
Diameter | - |
Material | Aluminum Alloy |
Fin Height | 1.969" (50.00mm) |
Package Cooled | TO-218, TO-220 |
Product Status | Active |
Material Finish | Black Anodized |
Attachment Method | Clip |
Thermal Resistance @ Natural | 7.13°C/W |
Power Dissipation @ Temperature Rise | 10.53W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.70°C/W @ 200 LFM |