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HSE08-505028

CUI Devices

Product No:

HSE08-505028

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-218/TO-

Quantity:

Delivery:

Payment:

In Stock : 1101

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    2.337

    2.337

  • 10

    2.2572

    22.572

  • 25

    2.19222

    54.8055

  • 50

    2.06169

    103.0845

  • 100

    1.852975

    185.2975

  • 250

    1.826888

    456.722

  • 500

    1.709449

    854.7245

  • 1000

    1.683343

    1683.343

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Product Information

Parameter Info
User Guide
Mfr CUI Devices
Type Board Level
Shape Rectangular, Angled Fins
Width 1.102" (28.00mm)
Length 1.969" (50.00mm)
Series HSE
Package Bag
Diameter -
Material Aluminum Alloy
Fin Height 1.969" (50.00mm)
Package Cooled TO-218, TO-220
Product Status Active
Material Finish Black Anodized
Attachment Method Clip
Thermal Resistance @ Natural 7.13°C/W
Power Dissipation @ Temperature Rise 10.53W @ 75°C
Thermal Resistance @ Forced Air Flow 2.70°C/W @ 200 LFM